BECKHOFF CB4055 Benutzerhandbuch
Seite 4
Inhalt
Seite 4
Beckhoff New Automation Technology CB4055
5.3.7
Super IO Configuration ....................................................................................................... 49
5.3.8
H/W Monitor ........................................................................................................................ 51
5.3.9
Serial Port Console Redirection .......................................................................................... 53
5.3.10
CPU PPM Configuration ..................................................................................................... 55
5.4
Chipset ........................................................................................................................................ 56
5.4.1
PCH-IO Configuration ......................................................................................................... 57
5.4.2
System Agent (SA) Configuration ....................................................................................... 64
5.5
Boot ............................................................................................................................................. 68
5.5.1
CSM Parameters ................................................................................................................. 70
5.6
Security ....................................................................................................................................... 71
5.6.1
Secure Boot Policy .............................................................................................................. 72
5.6.2
Key Management ................................................................................................................ 73
5.7
Save & Exit .................................................................................................................................. 75
5.8
BIOS-Update ............................................................................................................................... 76
6
Mechanische Zeichnung .................................................................................................................... 77
6.1
Leiterplatte: Bohrungen ............................................................................................................... 77
6.2
Leiterplatte: Pin-1-Abstände ....................................................................................................... 78
6.3
Leiterplatte: Kühlkörper/Die Center ............................................................................................. 79
7
Technische Daten .............................................................................................................................. 80
7.1
Elektrische Daten ........................................................................................................................ 80
7.2
Umgebungsbedingungen ............................................................................................................ 80
7.3
Thermische Spezifikationen ........................................................................................................ 81
8
Support und Service ........................................................................................................................... 82
8.1
Beckhoff-Support ........................................................................................................................ 82
8.2
Beckhoff-Service ......................................................................................................................... 82
8.3
Beckhoff-Firmenzentrale ............................................................................................................. 82
I
Anhang: Post-Codes .......................................................................................................................... 83
II
Anhang: Ressourcen .......................................................................................................................... 84
IO-Bereich ............................................................................................................................................... 84
Memory-Bereich ..................................................................................................................................... 84
Interrupt................................................................................................................................................... 84
PCI-Devices ............................................................................................................................................ 85
Ressourcen: SMB-Devices ..................................................................................................................... 85