Asus P7P55D-E Premium - Handbuch (Seite 33)

ASUS P7P55D-E Premium 2-13
Kapitel 2
P7P55D-E Premium Motherboard Liste qualifizierter Anbieter (QVL) DDR3-
1333MHz-Tauglichkeit für CPU bei 2.66, 2.8 und 2.93GHz (Fortsetzung)
Anbieter Artikelnummer Größe
SS/
DS
Chip-
Marke
Chip-Nr.
Timing
Dimm(Bios)
Spanng.
DIMM-Sockel-
Unterstützung
(Opt.)
A* B* C*
ELPIDA EBJ21UE8BAW0-DJ-E 2GB DS ELPIDA J1108BABG-DJ-E 9(1333-9-9-9-24) • • •
G.SKILL F3-10600CL7D-2GBPI
2GB
(Kit of 2) SS
N/A Heat-Sink Package (1337-7-7-7-18) 1.65 • •
G.SKILL F3-10600CL8D-2GBHK
2GB
(Kit of 2) SS
N/A Heat-Sink Package (1337-8-8-8-22) 1.65 • • •
G.SKILL
F3-10666CL7T-
6GBPK(XMP)
2GB DS N/A Heat-Sink Package 7-7-7-18(1333-7-7-7-18) 1.5-1.6 • • •
G.SKILL
F3-10666CL8D-
4GBHK(XMP)
4GB
(Kit of 2) DS
N/A Heat-Sink Package 8-8-8-21(1333-7-7-7-20) 1.5-1.6 • • •
G.SKILL F3-10666CL9T-6GBNQ
6GB
(Kit of 3) DS
N/A Heat-Sink Package 9-9-9-24(1333-9-9-9-24) 1.5 • • •
GEIL GV34GB1333C7DC
4GB
(Kit of 2) DS
N/A Heat-Sink Package 7-7-7-24(1333-8-8-8-28) 1.5 • •
Hynix HMT112U6BFR8C-H9 1GB SS Hynix H5TQ1G83BFR 9(1333-9-9-9-24) • • •
Hynix HMT125U6BFR8C-H9 2GB DS Hynix H5TQ1G83BFR 9(1333-9-9-9-24) • • •
Hynix HMT125U6BFR8C-H9 2GB DS Hynix H5TQ1G83BFRH9C 9(1333-9-9-9-24) • • •
KINGMAX FLFD45F-B8EE9 1GB SS ELPIDA J1108BASE-DJ-E (1333-9-9-9-24) • • •
KINGSTON KVR1333D3N9/1G 1GB SS ELPIDA J1108BABG-DJ-E 9(1066-8-7-7-20) 1.5 • • •
KINGSTON KVR1333D3N9/2G 2GB DS ELPIDA J1108BABG-DJ-E 1333-9-9-9-24 1.5 • • •
KINGSTON KVR1333D3N9/2G 2GB DS ELPIDA J1108BABG-DJ-E 9(1066-8-7-7-20) 1.5 • • •
MICRON
MT8JTF12864AY-
1G4BYES
1GB SS MICRON Z9HWR (1333-9-9-9-24) • •
MICRON MT8JTF12864AZ-1G4F1 1GB SS MICRON 9FF22 D9KPT 9(1066-8-8-8-20) • • •
MICRON MT16JTF25664AZ-1G4F1 2GB DS MICRON 9FF22 D9KPT 9(1066-8-8-8-20) • • •
OCZ OCZ3G1333LV3GK
3GB
(Kit of 3) SS
N/A Heat-Sink Package 9-9-9(1066-7-7-7-20) 1.65 • •
OCZ OCZ3P1333LV3GK
3GB
(Kit of 3) SS
N/A Heat-Sink Package 7-7-7(1066-7-7-7-16) 1.65 • • •
OCZ OCZ3P13332GK 1GB DS N/A Heat-Sink Package 7-7-7-20(1333-9-9-9-24) • •
OCZ OCZ3G13334GK
4GB
(Kit of 2) DS
N/A Heat-Sink Package 9(1066-8-9-9-20) 1.7 • •
OCZ OCZ3P13334GK
4GB
(Kit of 2) DS
N/A Heat-Sink Package 7(1333-7-7-7-20) 1.8 • • •
OCZ OCZ3RPX1333EB4GK
4GB
(Kit of 2) DS
N/A Heat-Sink Package (1066-6-5-5) 1.85 • • •
OCZ OCZ3G1333LV6GK
6GB
(Kit of 3) DS
N/A Heat-Sink Package 9-9-9(1066-7-7-7-20) 1.65 • • •
OCZ OCZ3P1333LV6GK
6GB
(Kit of 3) DS
N/A Heat-Sink Package 7-7-7(1066-7-7-7-20) 1.65 • • •
OCZ OCZX1333LV6GK(XMP)
6GB
(Kit of 3) DS
NA Heat-Sink Package 8-8-8(1066-7-7-7-16) 1.6 • • •
SAMSUNG M378B2873DZ1-CH9 1GB SS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •
SAMSUNG M378B2873EH1-CH9 1GB SS SAMSUNG K4B1G0846E 1066-8-7-7-20 • • •
SAMSUNG M391B2873DZ1-CH9 1GB SS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24) • • •
SAMSUNG M378B5673DZ1-CH9 2GB DS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •
SAMSUNG M378B5673EH1-CH9 2GB DS SAMSUNG K4B1G0846E 1066-8-7-7-20 • • •
SAMSUNG M391B5673DZ1-CH9 2GB DS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24) • • •
SAMSUNG M378B5273BH1-CH9 4GB DS SAMSUNG K4B2G0846B-HCH9 9(1333-9-9-9-24) • • •
Super
Talent
W1333UX2GB(XMP)
2GB
(Kit of 2) SS
N/A Heat-Sink Package 8(1333-8-8-8-24) 1.8 • • •
Transcend TS128MLK64V3U 1GB SS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •
Transcend TS256MLK64V3U 2GB DS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •
Asint SLY3128M8-EDJ 1GB SS Asint DDRIII1208-DJ (9-9-9-24) • • •
Asint SLY3128M8-EDJE 1GB SS ELPIDA J1108BASE-DJ-E 1066-8-8-8-20 • • •
Asint SLZ3128M8-EDJ 2GB DS Asint DDRIII1208-DJ (9-9-9-24) • • •
Asint SLZ3128M8-EDJE 2GB DS ELPIDA J1108BASE-DJ-E 1066-8-8-8-20 • • •
ASUS N/A 1GB DS N/A Heat-Sink Package (1333-9-9-9-24) • • •
BUFFALO FSX1333D3G-1G 1GB SS N/A Heat-Sink Package (1066-7-7-7-20) • • •
BUFFALO FSH1333D3G-T3G(XMP)
3GB
(Kit of 3) SS
N/A Heat-Sink Package 7-7-7-20(1066-8-7-7-20) • • •
BUFFALO FSX1333D3G-2G 2GB DS N/A Heat-Sink Package (1066-7-7-7-20) • • •
Elixir M2F2G64CB8HA4N-CG 2GB DS Elixir N2CB1G80AN-CG (1333-9-9-9-24) • • •
Patriot PDC32G1333LLK 1GB SS PATRIOT Heat-Sink Package 7(1337-7-7-7-20) 1.7 • • •