18 kapitel 2: hardware-beschreibungen – Asus Rampage II Extreme Benutzerhandbuch
Seite 46
2-18
Kapitel 2: Hardware-Beschreibungen
Rampage II Extreme Motherboard �iste qualifizierter Anbieter
(QV�) für DDR3-1600MHz
Anbieter
Teilnr.
Größe
SS/DS Chipnr.
CL
Chip-
Marke
DIMM-Steckplatz-
unterstützung
(optional))
A*
B*
CORSAIR Box P/N:TWIN3X2048-1600C7DHXIN
(CM3X1024-1600C7DHXIN) (XMP)
2048MB (Kit of 2) SS
Heat-Sink Package 7
N/A
V
V
CORSAIR BoxP/N:TW3X4G1600C9DHXNV
(CM3X2G1600C9DHXNV)
4096MB (Kit of 2) DS
Heat-Sink Package 9-9-9-24 N/A
V
V
CORSAIR BoxP/N:TWIN3X4096-1600C7DHXIN
(CM3X2048-1600C7DHXIN)
4096MB (Kit of 2) DS
Heat-Sink Package N/A
N/A
V
V
Crucial
BL12864BA1608.8SFB(XMP)
1024MB
SS
Heat-Sink Package N/A
PQI
V
V
G.SKILL
F3-12800CL7D-2GBHZ
2048MB (Kit of 2) SS
Heat-Sink Package 7-7-7-18 N/A
V
V
G.SKILL
F3-12800CL9D-2GBNQ
2048MB (Kit of 2) SS
Heat-Sink Package 9-9-9-24 N/A
V
V
G.SKILL
F3-12800CL7D-4GBPI
4096MB (Kit of 2) DS
Heat-Sink Package 7-7-7-18 N/A
V
V
Kingston
KHX12800D3K2/4G
4096MB (Kit of 2) SS
Heat-Sink Package N/A
N/A
V
V
OCZ
OCZ3P16002GK
2048MB (Kit of 2) SS
Heat-Sink Package 7
N/A
V
OCZ
OCZ3P1600EB1G
1024MB
SS
Heat-Sink Package N/A
N/A
V
OCZ
OCZ3T1600XM2GK (XMP)
(XMP)
1024MB
SS
Heat-Sink Package N/A
N/A
V
V
OCZ
OCZ3P1600EB4GK
4096MB (Kit of 2) DS
Heat-Sink Package 776
N/A
V
V
OCZ
OCZ3RPR16004GK
4096MB (Kit of 2) DS
Heat-Sink Package 7
N/A
V
Aeneon
AXH760UD10-16H
1024MB
SS
Heat-Sink Package 9
N/A
V
V
Aeneon
AXH860UD20-16H
2048MB
DS
Heat-Sink Package 9
N/A
V
V
Patriot
PVS34G1600LLKN
4096MB (Kit of 2) DS
Heat-Sink Package 7-7-7-20 N/A
V
V
PQI
MFADR401PA0102
2048MB
DS
K4B1G08460
9-9-9-24 SAMSUNG V
V
Team
BoxP/N:TXD32048M1600HC7DC
(TXD31024M1600HC7)
2048MB (Kit of 2) SS
Heat-Sink Package 7-7-7-21 N/A
V
V