BECKHOFF CB4058 Benutzerhandbuch
Seite 4
Inhalt
Seite 4
Beckhoff New Automation Technology CB4058
5.3.6
USB Configuration .............................................................................................................. 48
5.3.7
Super IO Configuration ....................................................................................................... 49
5.3.8
H/W Monitor ........................................................................................................................ 51
5.3.9
Serial Port Console Redirection .......................................................................................... 53
5.4
Chipset ........................................................................................................................................ 56
5.4.1
Host Bridge.......................................................................................................................... 57
5.4.2
South Bridge ....................................................................................................................... 60
5.5
Boot ............................................................................................................................................. 62
5.6
Security ....................................................................................................................................... 64
5.6.1
Secure Boot Policy .............................................................................................................. 65
5.6.2
Key Management ................................................................................................................ 66
5.7
Save & Exit .................................................................................................................................. 68
5.8
BIOS-Update ............................................................................................................................... 69
6
Mechanische Zeichnung .................................................................................................................... 70
6.1
Leiterplatte: Bohrungen ............................................................................................................... 70
6.2
Leiterplatte: Pin-1-Abstände ....................................................................................................... 71
6.3
Leiterplatte: Heat Sink ................................................................................................................. 72
7
Technische Daten .............................................................................................................................. 73
7.1
Elektrische Daten ........................................................................................................................ 73
7.2
Umgebungsbedingungen ............................................................................................................ 73
7.3
Thermische Spezifikationen ........................................................................................................ 74
8
Support und Service ........................................................................................................................... 75
8.1
Beckhoff-Support ........................................................................................................................ 75
8.2
Beckhoff-Service ......................................................................................................................... 75
8.3
Beckhoff-Firmenzentrale ............................................................................................................. 75
I
Anhang: Post-Codes .......................................................................................................................... 76
II
Anhang: Ressourcen .......................................................................................................................... 77
IO-Bereich ............................................................................................................................................... 77
Memory-Bereich ..................................................................................................................................... 77
Interrupt................................................................................................................................................... 77
PCI-Devices ............................................................................................................................................ 78
Ressourcen: SMB-Devices ..................................................................................................................... 78