BECKHOFF CB3053 - Handbuch (Seite 4)

Inhalt
Seite 4 Beckhoff New Automation Technology CB3053
5.4.2 Hard Disk Boot Priority ........................................................................................................ 44
5.5 Advanced Chipset Features ........................................................................................................ 45
5.6 Integrated Peripherals ................................................................................................................. 46
5.6.1 OnChip IDE Devices ........................................................................................................... 47
5.6.2 Onboard Devices ................................................................................................................ 48
5.6.3 SuperIO Devices ................................................................................................................. 49
5.6.4 USB Device Setting ............................................................................................................. 50
5.7 Power Management Setup ......................................................................................................... 51
5.7.1 HPET Feature ..................................................................................................................... 52
5.7.2 Intel DTS Feature ................................................................................................................ 53
5.8 PnP/PCI Configuration ................................................................................................................ 54
5.8.1 IRQ Resources .................................................................................................................... 55
5.9 PC Health Status ......................................................................................................................... 56
5.10 Load Fail-Safe Defaults............................................................................................................... 58
5.11 Load Optimized Defaults ............................................................................................................. 58
5.12 Set Password .............................................................................................................................. 58
5.13 Save & Exit Setup ....................................................................................................................... 58
5.14 Exit Without Saving ..................................................................................................................... 58
6 BIOS-Update ...................................................................................................................................... 59
7 Mechanische Zeichnung .................................................................................................................... 60
7.1 Leiterplatte: Bohrungen ............................................................................................................... 60
7.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 61
7.3 Leiterplatte: Die Center ............................................................................................................... 62
8 Technische Daten .............................................................................................................................. 63
8.1 Elektrische Daten ........................................................................................................................ 63
8.2 Umgebungsbedingungen ............................................................................................................ 63
8.3 Thermische Spezifikationen ........................................................................................................ 64
9 Support und Service ........................................................................................................................... 65
9.1 Beckhoff-Support ........................................................................................................................ 65
9.2 Beckhoff-Service ......................................................................................................................... 65
9.3 Beckhoff-Firmenzentrale ............................................................................................................. 65
I Anhang: Post-Codes .......................................................................................................................... 66
II Anhang: Ressourcen .......................................................................................................................... 69
A IO-Bereich ....................................................................................................................................... 69
B Memory-Bereich .............................................................................................................................. 69
C Interrupt ........................................................................................................................................... 69
D PCI-Devices .................................................................................................................................... 70
E Ressourcen: SMB-Devices ............................................................................................................. 70