BECKHOFF CB3060 - Handbuch (Seite 4)

Inhalt
Seite 4 Beckhoff New Automation Technology CB3060
5.3.8 USB Configuration .............................................................................................................. 60
5.3.9 Super IO Configuration ....................................................................................................... 61
5.3.10 H/W Monitor ........................................................................................................................ 63
5.3.11 Serial Port Console Redirection ......................................................................................... 65
5.3.12 Network Stack ..................................................................................................................... 68
5.3.13 Intel(R) Ethernet Connection I218-LM ................................................................................ 69
5.3.14 Intel(R) I210 Gigabit Network Connection .......................................................................... 71
5.3.15 Driver Health ....................................................................................................................... 73
5.4 Chipset ........................................................................................................................................ 75
5.4.1 PCH-IO Configuration ......................................................................................................... 76
5.4.2 System Agent (SA) Configuration ....................................................................................... 83
5.5 Boot ............................................................................................................................................ 93
5.5.1 CSM16 Parameters ............................................................................................................ 95
5.5.2 CSM Parameters ................................................................................................................ 96
5.6 Security ....................................................................................................................................... 97
5.6.1 Secure Boot Menu .............................................................................................................. 98
5.7 Save & Exit ............................................................................................................................... 101
5.8 BIOS-Update ............................................................................................................................ 102
6 Mechanische Zeichnung .................................................................................................................. 103
6.1 Leiterplatte: Bohrungen ............................................................................................................ 103
6.2 Leiterplatte: Pin-1-Abstände ..................................................................................................... 104
6.3 Leiterplatte: Heat Sink .............................................................................................................. 105
7 Technische Daten ............................................................................................................................ 106
7.1 Elektrische Daten ..................................................................................................................... 106
7.2 Umgebungsbedingungen ......................................................................................................... 106
7.3 Thermische Spezifikationen ..................................................................................................... 107
8 Support und Service ........................................................................................................................ 108
8.1 Beckhoff-Support ...................................................................................................................... 108
8.2 Beckhoff-Service ...................................................................................................................... 108
8.3 Beckhoff-Firmenzentrale .......................................................................................................... 108
I Anhang: Post-Codes ........................................................................................................................ 110
II Anhang: Ressourcen ....................................................................................................................... 111
IO-Bereich ............................................................................................................................................ 111
Memory-Bereich ................................................................................................................................... 111
Interrupt ................................................................................................................................................ 111
PCI-Devices ......................................................................................................................................... 112
Ressourcen: SMB-Devices .................................................................................................................. 112