BECKHOFF CB1052 - Handbuch (Seite 4)

Inhalt
Seite 4 Beckhoff New Automation Technology CB1052
4 BIOS-Einstellungen....................................................................................................................... 47
4.1 Benutzung des Setups.......................................................................................................... 47
4.2 Top-Menü............................................................................................................................. 47
4.3 Standard CMOS Features .................................................................................................... 48
4.3.1 SATA channels ................................................................................................................ 49
4.3.2 PATA channel .................................................................................................................. 50
4.4 Advanced BIOS Features ..................................................................................................... 51
4.4.1 CPU Feature .................................................................................................................... 53
4.4.2 Hard Disk Boot Priority ..................................................................................................... 54
4.5 Advanced Chipset Features.................................................................................................. 55
4.5.1 PCI Express Root Port Function ....................................................................................... 57
4.6 Integrated Peripherals .......................................................................................................... 58
4.6.1 OnChip IDE Devices......................................................................................................... 59
4.6.2 Onboard Devices.............................................................................................................. 61
4.6.3 SuperIO Devices .............................................................................................................. 62
4.6.4 USB Device Setting.......................................................................................................... 63
4.7 Power Management Setup ................................................................................................... 64
4.7.1 PCI Express PM Function................................................................................................. 66
4.7.2 Intel DTS Feature............................................................................................................. 67
4.8 PnP/PCI Configuration.......................................................................................................... 68
4.8.1 IRQ Resources................................................................................................................. 70
4.9 PC Health Status.................................................................................................................. 71
4.10 Frequency/Voltage Control ................................................................................................... 72
4.11 Load Fail-Safe Defaults ........................................................................................................ 73
4.12 Load Optimized Defaults....................................................................................................... 73
4.13 Set Password ....................................................................................................................... 73
4.14 Save & Exit Setup................................................................................................................. 73
4.15 Exit Without Saving .............................................................................................................. 73
5 BIOS-Update ................................................................................................................................ 74
6 Mechanische Zeichnung ............................................................................................................... 75
6.1 Leiterplatte: Bohrungen ........................................................................................................ 75
6.2 Leiterplatte: Pin-1-Abstände.................................................................................................. 76
6.3 Leiterplatte: Die Center......................................................................................................... 77
7 Technische Daten......................................................................................................................... 78
7.1 Elektrische Daten ................................................................................................................. 78
7.2 Umgebungsbedingungen...................................................................................................... 78
7.3 Thermische Spezifikationen.................................................................................................. 79
8 Support und Service ..................................................................................................................... 80
8.1 Beckhoff-Support.................................................................................................................. 80
8.2 Beckhoff-Service .................................................................................................................. 80
8.3 Beckhoff-Firmenzentrale....................................................................................................... 80
I Anhang: Post-Codes ..................................................................................................................... 81
II Anhang: Ressourcen .................................................................................................................... 84
A IO-Bereich ................................................................................................................................ 84
B Memory-Bereich ....................................................................................................................... 84
C Interrupt.................................................................................................................................... 84
D PCI-Devices ............................................................................................................................. 85
E Ressourcen: SMB-Devices ....................................................................................................... 85