BECKHOFF CB4050 Benutzerhandbuch
Seite 4
Inhalt
Seite 4
Beckhoff New Automation Technology CB4050
5.6.1
OnChip IDE Devices ........................................................................................................... 47
5.6.2
Onboard Devices ................................................................................................................ 48
5.6.3
SuperIO Devices ................................................................................................................. 49
5.7
Power Management Setup ......................................................................................................... 50
5.8
PnP/PCI Configuration ................................................................................................................ 52
5.8.1
IRQ Resources .................................................................................................................... 53
5.8.2
Memory Resources ............................................................................................................. 54
5.9
PC Health Status ......................................................................................................................... 55
5.10
Frequency/Voltage Control ......................................................................................................... 57
5.11
Load Fail-Safe Defaults............................................................................................................... 58
5.12
Load Optimized Defaults ............................................................................................................. 58
5.13
Set Password .............................................................................................................................. 58
5.14
Save & Exit Setup ....................................................................................................................... 58
5.15
Exit Without Saving ..................................................................................................................... 58
6
BIOS-Update ...................................................................................................................................... 59
7
Mechanische Zeichnung .................................................................................................................... 60
7.1
Leiterplatte: Maßzeichnung ......................................................................................................... 60
7.2
Leiterplatte: Pin1-Abstände ......................................................................................................... 61
7.3
Leiterplatte: Kühlkörper ............................................................................................................... 62
8
Technische Daten .............................................................................................................................. 63
8.1
Elektrische Daten ........................................................................................................................ 63
8.2
Umgebungsbedingungen ............................................................................................................ 63
8.3
Thermische Spezifikationen ........................................................................................................ 64
9
Support und Service ........................................................................................................................... 65
9.1
Beckhoff-Support ........................................................................................................................ 65
9.2
Beckhoff-Service ......................................................................................................................... 65
9.3
Beckhoff-Firmenzentrale ............................................................................................................. 65
I
Anhang: Post-Codes .......................................................................................................................... 66
II
Anhang: Ressourcen .......................................................................................................................... 69
A
IO-Bereich ....................................................................................................................................... 69
B
Memory-Bereich .............................................................................................................................. 69
C
Interrupt ........................................................................................................................................... 69
D
PCI-Devices .................................................................................................................................... 70
E
Ressourcen: SMB-Devices ............................................................................................................. 70