BECKHOFF CB1051 - Handbuch (Seite 4)

Inhalt
Seite 4 Beckhoff New Automation Technology CB1051
3.5.2 BIOS Select.......................................................................................................................47
3.5.3 Jumper: Keyboard Power (KBPWR) ..................................................................................48
4 BIOS-Einstellungen........................................................................................................................49
4.1 Benutzung des Setups ...........................................................................................................49
4.2 Top-Menü ..............................................................................................................................49
4.3 Standard CMOS Features......................................................................................................50
4.3.1 IDE Channel 0 Master/Slave..............................................................................................51
4.4 Advanced BIOS Features ......................................................................................................52
4.4.1 CPU Feature .....................................................................................................................54
4.4.2 Hard Disk Boot Priority.......................................................................................................55
4.5 Advanced Chipset Features ...................................................................................................56
4.5.1 PCI Express Root Port Function ........................................................................................58
4.6 Integrated Peripherals............................................................................................................59
4.6.1 OnChip IDE Devices..........................................................................................................60
4.6.2 Onboard Devices...............................................................................................................61
4.6.3 SuperIO Devices ...............................................................................................................62
4.7 Power Management Setup.....................................................................................................64
4.8 PnP/PCI Configuration...........................................................................................................66
4.8.1 IRQ Resources ..................................................................................................................68
4.9 PC Health Status ...................................................................................................................69
4.10 Frequency/Voltage Control ....................................................................................................71
4.11 Load Fail-Safe Defaults..........................................................................................................72
4.12 Load Optimized Defaults........................................................................................................72
4.13 Set Password ........................................................................................................................72
4.14 Save & Exit Setup..................................................................................................................72
4.15 Exit Without Saving................................................................................................................72
5 BIOS-Update .................................................................................................................................73
6 Mechanische Zeichnung ................................................................................................................74
6.1 Leiterplatte: Bohrungen..........................................................................................................74
7 Technische Daten ..........................................................................................................................75
7.1 Elektrische Daten...................................................................................................................75
7.2 Umgebungsbedingungen .......................................................................................................75
7.3 Thermische Spezifikationen ...................................................................................................76
8 Support und Service.......................................................................................................................77
8.1 Beckhoff-Support ...................................................................................................................77
8.2 Beckhoff-Service....................................................................................................................77
8.3 Beckhoff-Firmenzentrale........................................................................................................77
I Anhang: Post-Codes ......................................................................................................................78
II Anhang: Ressourcen......................................................................................................................81
A IO-Bereich .................................................................................................................................81
B Memory-Bereich ........................................................................................................................81
C Interrupt .....................................................................................................................................81
D PCI-Devices...............................................................................................................................82
E SMB-Devices .............................................................................................................................82