BECKHOFF CB3056 Benutzerhandbuch
Seite 4
Inhalt
Seite 4
Beckhoff New Automation Technology CB3056
4.3.8
H/W Monitor ........................................................................................................................ 52
4.3.9
Serial Port Console Redirection .......................................................................................... 54
4.3.10
CPU PPM Configuration ..................................................................................................... 56
4.4
Chipset ........................................................................................................................................ 57
4.4.1
PCH-IO Configuration ......................................................................................................... 58
4.4.2
System Agent (SA) Configuration ....................................................................................... 65
4.5
Boot ............................................................................................................................................. 69
4.5.1
CSM Parameters ................................................................................................................. 71
4.6
Security ....................................................................................................................................... 72
4.6.1
Secure Boot Policy .............................................................................................................. 73
4.6.2
Key Management ................................................................................................................ 74
4.7
Save & Exit .................................................................................................................................. 76
4.8
BIOS-Update ............................................................................................................................... 77
5
Mechanische Zeichnung .................................................................................................................... 78
5.1
Leiterplatte: Bohrungen ............................................................................................................... 78
5.2
Leiterplatte: Pin-1-Abstände ....................................................................................................... 79
5.3
Leiterplatte: Heat Sink ................................................................................................................. 80
6
Technische Daten .............................................................................................................................. 81
6.1
Elektrische Daten ........................................................................................................................ 81
6.2
Umgebungsbedingungen ............................................................................................................ 81
6.3
Thermische Spezifikationen ........................................................................................................ 82
7
Support und Service ........................................................................................................................... 83
7.1
Beckhoff-Support ........................................................................................................................ 83
7.2
Beckhoff-Service ......................................................................................................................... 83
7.3
Beckhoff-Firmenzentrale ............................................................................................................. 83
I
Anhang: Post-Codes .......................................................................................................................... 84
II
Anhang: Ressourcen .......................................................................................................................... 85
IO-Bereich ............................................................................................................................................... 85
Memory-Bereich ..................................................................................................................................... 85
Interrupt................................................................................................................................................... 85
PCI-Devices ............................................................................................................................................ 86
Ressourcen: SMB-Devices ..................................................................................................................... 86