BECKHOFF CB4053 - Handbuch (Seite 4)

Inhalt
Seite 4 Beckhoff New Automation Technology CB4053
6.3.1 IDE Channel 0 Master/Slave ............................................................................................... 44
6.4 Advanced BIOS Features ........................................................................................................... 45
6.4.1 CPU Feature ....................................................................................................................... 47
6.4.2 Hard Disk Boot Priority ........................................................................................................ 48
6.5 Advanced Chipset Features ........................................................................................................ 49
6.6 Integrated Peripherals ................................................................................................................. 50
6.6.1 OnChip IDE Devices ........................................................................................................... 52
6.6.2 Onboard Devices ................................................................................................................ 53
6.6.3 PCI Express Root Port Function ......................................................................................... 54
6.6.4 USB Device Setting ............................................................................................................. 55
6.7 Power Management Setup ......................................................................................................... 56
6.7.1 HPET Feature ..................................................................................................................... 57
6.7.2 Intel DTS Feature ................................................................................................................ 58
6.8 PnP/PCI Configuration ................................................................................................................ 59
6.8.1 IRQ Resources .................................................................................................................... 60
6.9 PC Health Status ......................................................................................................................... 61
6.10 Load Fail-Safe Defaults............................................................................................................... 63
6.11 Load Optimized Defaults ............................................................................................................. 63
6.12 Set Password .............................................................................................................................. 63
6.13 Save & Exit Setup ....................................................................................................................... 63
6.14 Exit Without Saving ..................................................................................................................... 63
7 BIOS-Update ...................................................................................................................................... 64
8 Mechanische Zeichnung .................................................................................................................... 65
8.1 Leiterplatte: Bohrungen ............................................................................................................... 65
8.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 66
8.3 Leiterplatte: Heat Sink ................................................................................................................. 67
9 Technische Daten .............................................................................................................................. 68
9.1 Elektrische Daten ........................................................................................................................ 68
9.2 Umgebungsbedingungen ............................................................................................................ 68
9.3 Thermische Spezifikationen ........................................................................................................ 69
10 Support und Service ........................................................................................................................... 70
10.1 Beckhoff-Support ........................................................................................................................ 70
10.2 Beckhoff-Service ......................................................................................................................... 70
10.3 Beckhoff-Firmenzentrale ............................................................................................................. 70
I Anhang: Post-Codes .......................................................................................................................... 71
II Anhang: Ressourcen .......................................................................................................................... 74
A IO-Bereich ....................................................................................................................................... 74
B Memory-Bereich .............................................................................................................................. 74
C Interrupt ........................................................................................................................................... 74
D PCI-Devices .................................................................................................................................... 75
E Ressourcen: SMB-Devices ............................................................................................................. 75