BECKHOFF CB3052 - Handbuch (Seite 4)

Inhalt
Seite 4 Beckhoff New Automation Technology CB3052
4.4.1 CPU Feature ....................................................................................................................... 48
4.4.2 Hard Disk Boot Priority ........................................................................................................ 49
4.5 Advanced Chipset Features ........................................................................................................ 50
4.5.1 PCI Express Root Port Function ......................................................................................... 51
4.6 Integrated Peripherals ................................................................................................................. 52
4.6.1 OnChip IDE Devices ........................................................................................................... 53
4.6.2 Onboard Devices ................................................................................................................ 55
4.6.3 SuperIO Devices ................................................................................................................. 56
4.6.4 USB Device Setting ............................................................................................................. 57
4.7 Power Management Setup ......................................................................................................... 58
4.7.1 PCI Express PM Function ................................................................................................... 60
4.7.2 Intel DTS Feature ................................................................................................................ 61
4.8 PnP/PCI Configuration ................................................................................................................ 62
4.8.1 IRQ Resources .................................................................................................................... 64
4.9 PC Health Status ......................................................................................................................... 65
4.10 Frequency/Voltage Control ......................................................................................................... 66
4.11 Load Fail-Safe Defaults............................................................................................................... 67
4.12 Load Optimized Defaults ............................................................................................................. 67
4.13 Set Password .............................................................................................................................. 67
4.14 Save & Exit Setup ....................................................................................................................... 67
4.15 Exit Without Saving ..................................................................................................................... 67
5 BIOS-Update ...................................................................................................................................... 68
6 Mechanische Zeichnung .................................................................................................................... 69
6.1 Leiterplatte: Bohrungen ............................................................................................................... 69
6.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 70
6.3 Leiterplatte: Heat Sink ................................................................................................................. 71
7 Technische Daten .............................................................................................................................. 72
7.1 Elektrische Daten ........................................................................................................................ 72
7.2 Umgebungsbedingungen ............................................................................................................ 72
7.3 Thermische Spezifikationen ........................................................................................................ 73
8 Support und Service ........................................................................................................................... 74
8.1 Beckhoff-Support ........................................................................................................................ 74
8.2 Beckhoff-Service ......................................................................................................................... 74
8.3 Beckhoff-Firmenzentrale ............................................................................................................. 74
I Anhang: Post-Codes .......................................................................................................................... 75
II Anhang: Ressourcen .......................................................................................................................... 78
A IO-Bereich ....................................................................................................................................... 78
B Memory-Bereich .............................................................................................................................. 78
C Interrupt ........................................................................................................................................... 78
D PCI-Devices .................................................................................................................................... 79
E Ressourcen: SMB-Devices ............................................................................................................. 80