BECKHOFF CB3063 Benutzerhandbuch

Seite 4

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Inhalt

Seite 4

Beckhoff New Automation Technology CB3063

5.3.4

CPU Configuration .............................................................................................................. 49

5.3.5

PPM Configuration.............................................................................................................. 53

5.3.6

SATA Configuration ............................................................................................................ 54

5.3.7

Miscellaneous Configuration .............................................................................................. 55

5.3.8

LPSS & SCC Configuration ................................................................................................ 56

5.3.9

Network Stack ..................................................................................................................... 58

5.3.10

Power Controller Options ................................................................................................... 59

5.3.11

CSM Configuration ............................................................................................................. 61

5.3.12

SDIO Configuration ............................................................................................................ 62

5.3.13

USB Configuration .............................................................................................................. 63

5.3.14

Security Configuration ........................................................................................................ 64

5.3.15

SIO Configuration ............................................................................................................... 65

5.4

Chipset ........................................................................................................................................ 68

5.4.1

North Bridge ........................................................................................................................ 69

5.4.2

South Bridge ....................................................................................................................... 73

5.5

Security ....................................................................................................................................... 77

5.5.1

Secure Boot menu .............................................................................................................. 78

5.6

Boot ............................................................................................................................................ 81

5.7

Save & Exit ................................................................................................................................. 82

5.8

BIOS-Update .............................................................................................................................. 83

6

Mechanische Zeichnung .................................................................................................................... 84

6.1

Leiterplatte: Bohrungen .............................................................................................................. 84

6.2

Leiterplatte: Heat Sink ................................................................................................................ 85

6.3

Leiterplatte: Pin-1-Abstände ....................................................................................................... 86

6.4

Leiterplatte: Outlines ................................................................................................................... 87

7

Technische Daten .............................................................................................................................. 88

7.1

Elektrische Daten ....................................................................................................................... 88

7.2

Umgebungsbedingungen ........................................................................................................... 88

7.3

Thermische Spezifikationen ....................................................................................................... 89

I

Anhang: Post-Codes .......................................................................................................................... 91

II

Anhang: Ressourcen ......................................................................................................................... 93

IO-Bereich .............................................................................................................................................. 93

Memory-Bereich ..................................................................................................................................... 93

Interrupt .................................................................................................................................................. 93

PCI-Devices ........................................................................................................................................... 94

Ressourcen: SMB-Devices .................................................................................................................... 94

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