BECKHOFF CB3063 Benutzerhandbuch
Seite 4

Inhalt
Seite 4
Beckhoff New Automation Technology CB3063
5.3.4
CPU Configuration .............................................................................................................. 49
5.3.5
PPM Configuration.............................................................................................................. 53
5.3.6
SATA Configuration ............................................................................................................ 54
5.3.7
Miscellaneous Configuration .............................................................................................. 55
5.3.8
LPSS & SCC Configuration ................................................................................................ 56
5.3.9
Network Stack ..................................................................................................................... 58
5.3.10
Power Controller Options ................................................................................................... 59
5.3.11
CSM Configuration ............................................................................................................. 61
5.3.12
SDIO Configuration ............................................................................................................ 62
5.3.13
USB Configuration .............................................................................................................. 63
5.3.14
Security Configuration ........................................................................................................ 64
5.3.15
SIO Configuration ............................................................................................................... 65
5.4
Chipset ........................................................................................................................................ 68
5.4.1
North Bridge ........................................................................................................................ 69
5.4.2
South Bridge ....................................................................................................................... 73
5.5
Security ....................................................................................................................................... 77
5.5.1
Secure Boot menu .............................................................................................................. 78
5.6
Boot ............................................................................................................................................ 81
5.7
Save & Exit ................................................................................................................................. 82
5.8
BIOS-Update .............................................................................................................................. 83
6
Mechanische Zeichnung .................................................................................................................... 84
6.1
Leiterplatte: Bohrungen .............................................................................................................. 84
6.2
Leiterplatte: Heat Sink ................................................................................................................ 85
6.3
Leiterplatte: Pin-1-Abstände ....................................................................................................... 86
6.4
Leiterplatte: Outlines ................................................................................................................... 87
7
Technische Daten .............................................................................................................................. 88
7.1
Elektrische Daten ....................................................................................................................... 88
7.2
Umgebungsbedingungen ........................................................................................................... 88
7.3
Thermische Spezifikationen ....................................................................................................... 89
I
Anhang: Post-Codes .......................................................................................................................... 91
II
Anhang: Ressourcen ......................................................................................................................... 93
IO-Bereich .............................................................................................................................................. 93
Memory-Bereich ..................................................................................................................................... 93
Interrupt .................................................................................................................................................. 93
PCI-Devices ........................................................................................................................................... 94
Ressourcen: SMB-Devices .................................................................................................................... 94