BECKHOFF CB2051 Benutzerhandbuch

Seite 4

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Inhalt

Seite 4

Beckhoff New Automation Technology CB2051

4.4.2

Hard Disk Boot Priority ..................................................................................................... 49

4.5

Advanced Chipset Features.................................................................................................. 50

4.5.1

PCI Express Root Port Function ....................................................................................... 52

4.6

Integrated Peripherals .......................................................................................................... 53

4.6.1

OnChip IDE Devices......................................................................................................... 54

4.6.2

Onboard Devices.............................................................................................................. 55

4.6.3

SuperIO Devices .............................................................................................................. 56

4.7

Power Management Setup ................................................................................................... 58

4.8

PnP/PCI Configuration.......................................................................................................... 60

4.8.1

IRQ Resources................................................................................................................. 61

4.9

PC Health Status.................................................................................................................. 62

4.10

Frequency/Voltage Control ................................................................................................... 64

4.11

Load Fail-Safe Defaults ........................................................................................................ 65

4.12

Load Optimized Defaults....................................................................................................... 65

4.13

Set Password ....................................................................................................................... 65

4.14

Save & Exit Setup................................................................................................................. 65

4.15

Exit Without Saving .............................................................................................................. 65

5

BIOS-Update ................................................................................................................................ 66

6

Mechanische Zeichnung ............................................................................................................... 67

6.1

Leiterplatte: Bohrungen ........................................................................................................ 67

6.2

Leiterplatte: Pin1-Abstände................................................................................................... 68

6.3

Leiterplatte: Die-Mittelpunkte ................................................................................................ 69

7

Technische Daten......................................................................................................................... 70

7.1

Elektrische Daten ................................................................................................................. 70

7.2

Umgebungsbedingungen...................................................................................................... 70

7.3

Thermische Spezifikationen.................................................................................................. 71

8

Support und Service ..................................................................................................................... 72

8.1

Beckhoff-Support.................................................................................................................. 72

8.2

Beckhoff-Service .................................................................................................................. 72

8.3

Beckhoff-Firmenzentrale....................................................................................................... 72

I

Anhang: Post-Codes ..................................................................................................................... 73

II

Anhang: Ressourcen .................................................................................................................... 76

A

IO-Bereich ................................................................................................................................ 76

B

Memory-Bereich ....................................................................................................................... 76

C

Interrupt.................................................................................................................................... 76

D

PCI-Devices ............................................................................................................................. 77

E

SMB-Devices............................................................................................................................ 77

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